SOURCE-LINKED INTELLIGENCE
Toward 3D Printable Non-Planar Electroadhesive Structures for Active Anchoring
This paper investigates multi-material 3D printing as a method to fabricate non-planar structures with 3D-printed electrode patterns for electroadhesion. We printed flat electroadhesion pads as a planar benchmark and cylindrical pads as a non-planar demonstration, with conductive interdigitated electrodes 3D printed as part of the structure. Normal-force measurements showed voltage-controlled modulation in both geometries. At 3 kV, the flat pads generated approximately 0.11-0.13 N, while the cylindrical pads reached approximately 0.16 N at 5 N preload. These results demonstrate a step toward p
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Evidence & attribution
- arXiv · AI, language, vision and robotics · 2026-09-16T14:10:30.000Z
First collected: 2026-09-19T20:28:26.698Z. This is not the publication date.