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Light-based Ultrafast Modules for Efficient Nanolaser-enhanced processors

CORDIS · observation · Publication date unknown

Light-based Ultrafast Modules for Efficient Nanolaser-enhanced processors The rapid growth of Artificial Intelligence and other advanced technologies is driving a strong demand for high-performance electronics and faster computing. System-in-Package (SiP) technology addresses this need by combining digital, analogue and memory components within a single package to reduce latency. However, traditional copper interposers are reaching their limits. They struggle to provide the bandwidth, chiplet-to-chiplet connectivity and thermal management required for modern applications, which hinders overall efficiency and performance. Optical interposers are emerging as a promising alternative. By using light instead of electrical signals, they enable faster data transfer, improved energy efficiency and better heat control. This is particularly important for applications such as AI, machine learning and high-performance computing. Compared with copper-based systems, optical interposers reduce

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award

status

SIGNED

region

EU

value

2498797.15

unit

EUR